SCOPUS 정보 검색 플랫폼

Acta Materialia

Volumn 57, Issue 17, 2009, Pages 5196-5206

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

(3) Shen, J a Chan, Y C a Liu, S Y b

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

b UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

Growth mechanism; Interfacial reaction; Microstructure; Sn Ni

Indexed keywords

GRAIN BOUNDARY GROOVING; GRAIN COARSENING; GRAIN-BOUNDARY DIFFUSION; GROWTH MECHANISM; GROWTH MECHANISMS; GROWTH PROCESS; GROWTH TIME; INTERFACIAL REACTION; INTERFACIAL REACTIONS; MATHEMATICAL CALCULATIONS; MICROSTRUCTURAL OBSERVATIONS; MOLTEN SOLDERS; NET EFFECT; SIMPLE MODEL; SN-3.5AG; SN-3.5AG LEAD-FREE SOLDERS; SN/NI; VOLUME DIFFUSION;

CHEMICAL COMPOUNDS; DISSOLUTION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LEAD; METAL RECOVERY; MICROSTRUCTURE; NICKEL; SILVER;

TIN;

EID: 69949125659 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2009.07.021 Document Type: Article

Times cited : (121)

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