Thermomigration versus electromigration in microelectronics solder joints

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 3, 2009, Pages 627-635

  Abdulhamid, Mohd F ^a   Basaran, Cemal ^a   Lai, Yi Shao ^b  

^a UNIVERSITY AT BUFFALO   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Diffusion; Electromigration; Lead free solder; Thermomigration

Indexed keywords

COLD SIDE; COMPETING MECHANISMS; DRIVING FORCES; FLIP CHIP; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MIGRATION PROCESS; ROOM TEMPERATURE; SCANNING ELECTRON MICROSCOPES; SOLDER JOINTS; TEST VEHICLE; THERMOMIGRATION;

AUTOMOBILE ELECTRONIC EQUIPMENT; BRAZING; DIFFUSION; DISSOLUTION; ELECTROMIGRATION; METAL RECOVERY; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN; WELDING;

LEAD;

EID: 68949183355     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2018293     Document Type: Article

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