Stochastic simulation of electromigration failure of flip chip solder bumps

Microelectronics Journal

Volumn 32, Issue 1, 2001, Pages 53-60

  Tang, Z ^a   Shi, F G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMIGRATION; FAILURE ANALYSIS; RANDOM PROCESSES; SOLDERING; TIN ALLOYS;

SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0035192617     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00100-2     Document Type: Article

References (11)

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