Electromigration characteristics of flip chip Sn-3.5Ag solder bumps under highly accelerated conditions

Journal of the Korean Physical Society

Volumn 54, Issue 5 PART 1, 2009, Pages 1784-1792

  Lee, Jang Hee ^a   Lim, Gi Tae ^a   Park, Young Bae ^a   Yang, Seung Taek ^b   Suh, Min Suk ^b   Chung, Qwan Ho ^b   Byun, Kwang Yoo ^b  

^a Andong National University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Electromigration; Flip chip bump; Joule heating; Pb free solder; Sn Ag alloy

Indexed keywords

EID: 68049120090     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.54.1784     Document Type: Article

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