Experimental investigations and model study of moisture behaviors in polymeric materials

Microelectronics Reliability

Volumn 49, Issue 8, 2009, Pages 861-871

  Fan, X J ^a,c   Lee, S W R ^b   Han, Q ^c  

^a Lamar University   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION KINETICS; AGING EFFECTS; APPROXIMATE ESTIMATION; DIFFUSION MECHANISMS; EXPERIMENTAL INVESTIGATIONS; FUNDAMENTAL CHARACTERISTICS; GLASS TRANSITION TEMPERATURE; GOVERNING EQUATIONS; HYDROPHOBIC FILM; HYDROPHOBIC MATERIAL; HYGROSCOPIC SWELLING; INTERFEROMETRY TECHNIQUE; LIQUID MOLECULES; MATHEMATICAL DESCRIPTIONS; MERCURY INTRUSION; MODEL STUDY; MOISTURE CONCENTRATION; MOISTURE CONTENTS; MOISTURE EFFECTS; MOISTURE SORPTION; MOISTURE WEIGHT; MOLD COMPOUNDS; NON-FICKIAN; NON-FICKIAN DIFFUSION; POLYMER MATERIALS; POLYMERIC MATERIAL; REFLOW PROCESS; RELATIVE HUMIDITIES; SOFT FILM; UNDERFILL; VISCOELASTIC DEFORMATION; WATER MOLECULE; WATER SORPTION; WATER VAPOR TRANSMISSION; WEIGHT GAIN;

ATMOSPHERIC HUMIDITY; DEFORMATION; ELECTRONICS PACKAGING; FREE VOLUME; GLASS; GLASS TRANSITION; HYDROPHOBICITY; MERCURY (METAL); MOISTURE; MOLECULES; POLYMERS; PORE SIZE; SORPTION; SUPERCONDUCTING TRANSITION TEMPERATURE; SURFACE DIFFUSION; SWELLING; TITRATION; WATER VAPOR;

PACKAGING MATERIALS;

EID: 67650450236     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.03.006     Document Type: Article

References (47)

1. Fan XJ. Moisture related reliability in electronic packaging, electronic component technology conference (ECTC) short course notes; 2008.
2. Zhang G.Q., van Driel W.D., and Fan X.J. Mechanics of microelectronics (2006), Springer
3. Fan X.J., Zhang G.Q., van Driel W.D., and Ernst L.J. Interfacial delamination mechanisms during reflow with moisture preconditioning. IEEE Trans Compon Pack Technol 31 2 (2008) 252-259
4. Lau J.H., and Lee S.W.R. Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method. ASME J Electron Pack 122 1 (2005) 34-41
5. van Driel W.D., van Gils M.A.J., Fan X.J., Zhang G.Q., and Ernst L.J. Driving mechanisms of delamination related reliability problems in exposed pad packages. IEEE Trans Compon Pack Technol 31 2 (2008) 260-268
6. Bond D.A., and Smith P.A. Modeling the transport of low-molecular-weight penetrants within polymer matrix composites. Appl Mech Rev 59 (2006) 249-268
7. Galloway J.E., and Miles B.M. Moisture absorption and desorption predictions for plastic ball grid array packages. IEEE Trans Comp Pack Manuf Technol A 20 3 (1997) 274-279
8. Shook R., Conrad T., Sastry V., and Steele D. Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions. IEEE Trans Comp Pack Manuf Technol 19 2 (1996) 110-118
9. Fan XJ, Zhou J, Chandra A. Package structural integrity analysis considering moisture. In: Proceedings of electronic components and technology conference (fifty-eight ECTC), p. 1054-66; 2008.
10. Shi X.Q., Zhang Y.L., Zhou W., and Fan X.J. Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly. IEEE Trans Compon Pack Technol 31 1 (2008) 94-103
11. He Y, Fan XJ. In-situ characterization of moisture absorption and desorption in a thin BT core substrate. In: Proceedings of electronic components and technology conference (ECTC), p. 1375-83; 2007.
12. Shirangi MH, Fan XJ, Michel B. Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in epoxy molding compounds. In: Proceedings of forty-first international symposium on microelectronics (IMAPS), p. 917-23; 2008.
13. van der Wel G.K., and Adan O.C.G. Moisture in organic coatings - a review. Prog Org Coat 37 (1999) 1-14
14. Vrentas J.S., and Duda J.L. Diffusion in polymer-solvent systems II, a predictive theory for the dependence of diffusion coefficients on temperature, concentration and molecular weight. J Polym Sci Polym Phys Ed 15 (1977) 417-439
15. Hopfenberg H.B., Stannett V.T., and Folk G.M. Sorption kinetics and equilibriam in annealed glassy polyblends. Polym Eng Sci 15 4 (1975) 261-267
16. Xie B, Fan XJ, Shi XQ, Han D. Direct concentration approach of moisture diffusion and whole field vapor pressure modeling for reflow process: part I - Theory and numerical implementation. ASME J Electron Pack, 2009;131(3):in press.
17. Xie B, Fan XJ, Shi XQ, Han D. Direct concentration approach of moisture diffusion and whole field vapor pressure modeling for reflow process: part II - Application to 3-D ultra-thin stacked-die chip scale packages. ASME J Electron Pack, 2009;131(3);in press.
18. Fan XJ. Mechanics of moisture for polymers: fundamental concepts and model study. In: Proceedings of the international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (EuroSimE), p. 159-72; 2008.
19. Cui CQ, Fan XJ. Unpublished report on the study of a hydrophobolic coating membrane for preventing moisture-induced failures for QFN packages; 1999.
20. Personal communications with Mr. Winkler P. of Badger Meter Inc.; 2009.
21. Tsenoglou C.J., Pavlidou S., and Papaspyrides C.D. Evaluation of interfacial relaxation due to water absorption in fiber-polymer composites. Compos Sci Technol 66 (2006) 2855-2864
22. Webb P.A. An introduction to the physical characterization of materials by mercury intrusion porosimetry with emphasis on reduction and presentation of experimental data. Micromeritics Instr Corp (2001)
23. Koning P, Prack E. Unpublished report on mercury intrusion porosimetry measurement for several kinds of polymer materials; 2006.
24. Shi XQ, Fan XJ. Wafer-level film selection for stacked-die chip scale packages. In: Proceedings of electronic components and technology conference (fifty-seventh ECTC), p. 1731-736; 2007.
25. Soles L.C., Chang F.T., Bolan B.A., Hristov H.A., Gidley D.W., et al. Contributions of the nanovoid structure to the moisture absorption properties of epoxy resins. J Polym Sci: Part B: Polym Phys 36 (1998) 3035-3048
26. Fan XJ, Lim TB. Mechanism analysis for moisture-induced failures in IC packages. ASME International Mechanical Engineering Congress and Exposition, IMECE/EPE-14; 1999.
27. Fan XJ, Zhang GQ, Ernst LJ. A micro-mechanics approach in polymeric material failures in microelectronic packaging. In: Proceedings of third international conference on thermal and mechanical simulation in micro-electronics (EuroSimE), p. 154-64; 2002.
28. Fan XJ, Zhang GQ, van Driel WD, Ernst LJ. Analytical solution for moisture-induced interface delamination in electronic packaging. In: Proceedings of electronic components and technology conference, p. 733-38; 2003.
29. Stellrecht E., Han B., and Pecht M.G. Characterization of hygroscopic swelling behavior of mold compounds and plastic packages. IEEE Trans Compon Pack Technol 27 3 (2004) 499-505
30. Wong EH, Chan KC, Rajoo R, Lim TB. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging. In: Proceedings of fiftieth Electron electronic component technology conference, Las Vegas, NV, p. 576-80; 2000.
31. Zhou J., et al. Effect of non-uniform moisture distribution on the hygroscopic swelling coefficient". IEEE Trans Compon Pack Technol 31 2 (2008) 269-276
32. Zhou J., and Lucas J.P. Hygrothermal effects of epoxy resin. Part I: The nature of water in epoxy. Polymer 40 (1999) 5505-5512
33. Zhang G.Q., and Fan X.J. Overview: characterization and modeling of moisture behavior of electronic packaging. Micromater Nanomater 3 (2004) 12-27
34. Vanderhart D.L., Schen M.A., and Davis G.T. Partitioning of water between voids and the polymer matrix in a polymer compound by proton NMR: the role of larger voids in the phenomena of popcorning and delamination. Int J Microcircuits Electron Pack 22 4 (1999)
35. Toprak C., Agar J.N., and Falk M. State of water in cellulose acetate membranes. J Chem Soc, Faraday Trans I 75 (1979) 803
36. McMaster M.G., and Soane D.S. Water sorption in epoxy thin films. IEEE Trans Compon Hybrid Manuf Technol 12 3 (1989) 373-386
37. Delasi R, Whiteside JB. Advances composite materials - environmental effects, Vinson JR, editor, ASTM STP-658; 1978.
38. Mckague E.L., Reynolds J.D., and Halkias J.E. Trans Am Soc Mech Eng 98 (1976) 92
39. Fan X.J., Zhou J., and Zhang G.Q. Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling. J Microelectron Reliab 44 (2004) 1967-1976
40. Hui C.Y., Muralidharan V., and Thompson M.O. Steam pressure induced in crack-like cavities in moisture saturated polymer matrix composites during rapid heating. Int J Solids Struct 42 (2005) 1055-1072
41. Roy S., and Xu W. Modeling of diffusion in the presence of damage in polymer matrix composites. Int J Solids Struct 38 (2001) 115-125
42. Roy S., Xu W., Patel S., and Case S. Modeling moisture diffusion in the presence of bi-axial damage in polymer matrix composite laminates. Int J Solids Struct 38 (2001) 7627-7641
43. Rajagopal K.R. Diffusion through polymers undergoing large deformations. Mater Sci Technol 19 9 (2003) 1175-1180
44. Sullivan R.M., and Stokes E.H. A model for the effusion of water in carbon phenolic. Compos Mech Mater 26 (1997) 197-207
45. Fan X.J., Zhou J., Zhang G.Q., and Ernst L.J. A micromechanics based vapor pressure model in electronic packages. ASME J Electron Pack 127 3 (2005) 262-267
46. Tee TY, Fan XJ, Lim TB. Modeling of whole field vapor pressure during reflow for flip chip and wire-bond PGBA Packages. First international workshop on electronic materials & packaging (EMAP), Singapore; 1999.
47. Tee T.Y., and Zhong Z.W. Integrated vapor pressure, hygroswelling and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. Microelectron Reliab 44 1 (2004) 105-114