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Volumn , Issue , 2003, Pages 733-738

Analytical solution for moisture-induced interface delamination in electronic packaging

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; COMPOSITE MICROMECHANICS; DEFORMATION; DELAMINATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MOISTURE; POROSITY; VAPOR PRESSURE;

EID: 0038350772     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (39)

References (10)
  • 3
    • 45449104355 scopus 로고    scopus 로고
    • A micromechanics approach for polymeric material failures in microelectronic packaging
    • Fan, X.J., Zhang, G.Q., and Ernst, L.J., "A Micromechanics Approach for Polymeric Material Failures in Microelectronic Packaging", Proc. ESIME 2002
    • Proc. ESIME 2002
    • Fan, X.J.1    Zhang, G.Q.2    Ernst, L.J.3
  • 4
    • 0035893384 scopus 로고    scopus 로고
    • Thermal and vapor pressure effects on cavitation and void growth
    • Guo, T.F., & Cheng, L., Thermal and Vapor Pressure Effects on Cavitation and Void Growth, Journal of Materials Science, 36(2001), 5871-5879
    • (2001) Journal of Materials Science , vol.36 , pp. 5871-5879
    • Guo, T.F.1    Cheng, L.2
  • 6
    • 0029341581 scopus 로고
    • Void behavior due to internal vapor pressure induced by temperature rise
    • Fan, X.J., & Zhang, S.Y., "Void Behavior Due to Internal Vapor Pressure Induced by Temperature Rise", Journal of Materials Science, 30, 1995, 3483-3489.
    • (1995) Journal of Materials Science , vol.30 , pp. 3483-3489
    • Fan, X.J.1    Zhang, S.Y.2
  • 7
    • 0031234029 scopus 로고    scopus 로고
    • Moisture absorption and desorption predictions for plastic ball grid array packages
    • Galloway, J.E., and Miles, B.M., "Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages", IEEE Trans-CPMT-A, 20(3), 1997, 274-279
    • (1997) IEEE Trans-CPMT-A , vol.20 , Issue.3 , pp. 274-279
    • Galloway, J.E.1    Miles, B.M.2
  • 8
    • 0038140885 scopus 로고    scopus 로고
    • Unstable void growth in plastic IC packaging material
    • submitted
    • Guo, T.F. & Cheng, L., "Unstable Void Growth in Plastic IC Packaging Material", Scripta Materialia, 2001, submitted.
    • (2001) Scripta Materialia
    • Guo, T.F.1    Cheng, L.2
  • 9
    • 0003474569 scopus 로고
    • Homogenization: Averaging processes in perioidc media
    • Kluwer Academic Publisher
    • Bakhvalov, B.S., & Panasenko, G.P., Homogenization: Averaging Processes in Perioidc Media, Kluwer Academic Publisher, 1989.
    • (1989)
    • Bakhvalov, B.S.1    Panasenko, G.P.2
  • 10
    • 44049109778 scopus 로고
    • The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
    • Tvergaard, V., and Hutchinson, J.W., "The Relation Between Crack Growth Resistance and Fracture Process Parameters in Elastic-Plastic Solids", Journal of Mechanics and Physics of Solids, 1992, 40, 1377-1397.
    • (1992) Journal of Mechanics and Physics of Solids , vol.40 , pp. 1377-1397
    • Tvergaard, V.1    Hutchinson, J.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.