Wafer-level film selection for stacked-die chip scale packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1731-1736

  Shi, Daniel ^a   Fan, Xuejun ^a  

^a INTEL CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; ELASTIC MODULI; FINITE ELEMENT METHOD; HYDROSTATIC PRESSURE; MODULATORS; SOLDERING;

COHESIVE FAILURE; MATERIAL CHARACTERIZATION; THIN WAFERS; WAFER LEVEL FILMS;

ELECTRONICS PACKAGING;

EID: 35348814883     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374029     Document Type: Conference Paper

References (10)

1. Edward Prack and Xuejun Fan, Root cause mechanisms for delamination/cracking in stack-die chip scale packages, International Symposium on Semiconductor Manufacturing (ISSM), 2006, September 25 - 27, Tokyo, Japan
2. Yi He and Xuejun Fan, In-situ characterization of moisture absorption, desorption, and diffusion in a thin BT core substrate, IEEE Electronic Components and Technology Conference (ECTC), 2007
3. J. E. Galloway and B. M. Miles, Moisture absorption and desorption predictions for plastic ball grid array packages, IEEE Trans. Comp. Packag. Manuf. Technol., vol. 20, pp. 274-279, 1997.
4. Bin Xie, Daniel Shi, and Xuejun Fan, Sensitivity investigation of reflow profile and substrate thickness on wafer level film failures in 3-D chip scale packages by finite element modeling, Intel report, 2007
5. Zhenyu Huang, John Tang, Changmin Hu, Michael Wang, Mu Zhang, Bin Liu, Xuejun Fan, and Edward Prack, Moisture Induced Cohesive Delamination in DieAttach Film in Ultra-Thin Stacked Chip-Scale Package, Intel Assembly Test and Technology Journal, 2006
6. G. Q. Zhang, W. D. van Driel, and X. J. Fan , Mechanics of Microelectronics, Springer, May 2006
7. X.J. Fan, J. Zhou, G.Q. Zhang, & L.J. Ernst, A Micromechanics based vapor pressure model in electronic packages, ASME Journal of Electronic Packaging, 2005, 127 (3), 262-267
8. Xuejun Fan, Ibrahim Bekar, Fischer, Anthony A, Yi He, Zhengyu Huang, Edward Prack, Delamination/cracking mechanism study for ultra-thin stacked-die chip scale packages, Intel Conference on Manufacturing Excellence (IMEC), 2006, San Diego, CA
9. Daniel Shi, Xuejun Fan, Ibrahim Bekar, Xuejun Fan, Intel Report on Failure Analysis of Die-Attach Film Selection, 2006
10. Xuejun Fan, G.Q. Zhang, and L.J. Ernst, Interfacial delamination mechanisms during reflow with moisture preconditioning, IEEE Transaction of Component, Manufacturing andPackaging Technology (accepted)