Direct concentration approach of moisture diffusion and whole-field vapor pressure modeling for reflow process-part II: Application to 3D ultrathin stacked-die chip scale packages

Journal of Electronic Packaging

Volumn 131, Issue 3, 2009, Pages 0310111-0310116

  Xie, B ^a   Fan, X J ^b,c   Shi, X Q ^d   Ding, H ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Lamar University   (United States)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^d HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

Author keywords

Cavitation; Chip scale package; Cohesive failure; Desorption; Die attach; Direct concentration approach; Moisture diffusion; Reflow; Soft film; Unstable void growth; Vapor pressure; Wafer level film (WLF)

Indexed keywords

DIFFUSION; FAILURE ANALYSIS; FILM GROWTH; HYDROSTATIC PRESSURE; THREE DIMENSIONAL COMPUTER GRAPHICS; VAPOR PRESSURE;

CHIP-SCALE PACKAGE; COHESIVE FAILURES; DIE-ATTACH; DIRECT CONCENTRATION; DIRECT CONCENTRATION APPROACH; MOISTURE DIFFUSION; REFLOW; SOFT FILM; UNSTABLE VOID GROWTH; VAPOUR PRESSURES; WAFER LEVEL; WAFER LEVEL FILM;

MOISTURE;

EID: 77950684821     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3144154     Document Type: Article

References (19)

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