Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 2, 1996, Pages 110-118

  Shook, Richard L ^a   Conrad, Timothy R ^a   Srirama Sastry, V ^a   Steele, David B ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ATMOSPHERIC HUMIDITY; CALCULATIONS; COMPUTER SIMULATION; DESORPTION; DIFFUSION; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MOISTURE; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

BALL GRID ARRAY; C MODE SCANNING ACOUSTIC MICROSCOPY; PLASTIC QUAD FLAT PACK;

INTEGRATED CIRCUIT TESTING;

EID: 0030124438     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.507147     Document Type: Article

References (12)

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3. Y. Orii An advanced method of soldering heat resistance for ultra thin plastic encapsulated LSI's 213 220 1991
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5. J. Crank The Mathematics of Diffusion. 1979 Oxford University Press U.K., London
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8. EDX-4701, Test method of resistance to soldering heat of surface mounting devices for integrated circuits 1990 Electronic Industries Association of Japan
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10. R. Shook T. Conrad Moisture/reflow sensitivity of plastic packaged surface mount ICs: Theory, evaluation, and avoidance 33rd Int. Rel. Phy. Sym. Tutorials 1.1 1.38 1995
11. H. S. Carslaw J. C. Jaeger Conduction of Heat in Solids. 1980 Oxford University Press U.K., London
12. R. Shook Moisture sensitivity characterization of plastic surface mount devices using scanning acoustic microscopy Proc. 30th Rel. Phys. Sym. 157 168 1992 612 4772 187641