Direct concentration approach of moisture diffusion and whole-field vapor pressure modeling for reflow process-part I: Theory and numerical implementation

Journal of Electronic Packaging

Volumn 131, Issue 3, 2009, Pages 0310101-0310107

  Xie, B ^a   Fan, X J ^b,c   Shi, X Q ^d   Ding, H ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Lamar University   (United States)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^d HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

Author keywords

Direct concentration approach (DCA); Electronic package; Moisture diffusion; Multiscale analysis; Reflow; Vapor pressure

Indexed keywords

DIFFUSION; HYDROSTATIC PRESSURE; MOISTURE; PACKAGING; VAPOR PRESSURE;

DIRECT CONCENTRATION; DIRECT CONCENTRATION APPROACH; ELECTRONIC PACKAGE; MOISTURE CONCENTRATION; MOISTURE DIFFUSION; MULTI SCALE ANALYSIS; REFLOW; REFLOW PROCESS; VAPOR PRESSURE MODEL; VAPOUR PRESSURES;

INTERFACES (MATERIALS);

EID: 77950651258     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3144147     Document Type: Article

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