Effect of intermetallic on electromigration and atomic diffusion in Cu/SnAg 3.0Cu 0.5/Cu joints: Experimental and first-principles study

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 866-872

  Zhou, Wei ^a,b   Liu, Lijuan ^a,b   Li, Baoling ^a,b   Wu, Ping ^a  

^a TIANJIN UNIVERSITY   (China)

^b Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology   (China)

Author keywords

Diffusion; Electromigration; Hillock; Intermetallic

Indexed keywords

AG ATOMS; ATOMIC DIFFUSIONS; CURRENT-STRESSING; DIFFUSION BEHAVIOR; ELECTROMIGRATION DAMAGE; FIRST PRINCIPLES METHOD; FIRST-PRINCIPLES STUDY; FREE SURFACES; HILLOCK; INTERMETALLIC COMPOUNDS; NONUNIFORM CURRENT;

ATOMS; DIFFUSION; GRAIN BOUNDARIES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SOLID STATE PHYSICS; SURFACE DIFFUSION;

ELECTROMIGRATION;

EID: 67650444303     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0760-0     Document Type: Conference Paper

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