The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

Journal of Electronic Materials

Volumn 36, Issue 10, 2007, Pages 1378-1382

  Kuo, Shih Ming ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Hillock

Indexed keywords

HILLOCK FORMATION; ROOM TEMPERATURE;

COMPRESSIVE STRESS; COPPER; DIFFUSION; ELECTROMIGRATION; TIN;

LAMELLAR STRUCTURES;

EID: 34848916390     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0209-2     Document Type: Article

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