Discharge-based pressure sensors for high-temperature applications using three-dimensional and planar microstructures

Journal of Microelectromechanical Systems

Volumn 18, Issue 3, 2009, Pages 736-743

  Wright, Scott A ^a   Gianchandani, Yogesh B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Plasma applications; Plasma confinement; Plasma measurements; Plasma properties; Pressure effects; Sensitivity

Indexed keywords

3D ARRAYS; ACTIVE AREA; BULK METALS; CARRIER GAS; CHEMICAL SENSING SYSTEMS; CURRENT DISTRIBUTION; DYNAMIC RANGE; ELECTRODE DIAMETERS; HIGH TEMPERATURE; INTER-ELECTRODE SPACING; MAXIMUM SENSITIVITY; MICRODISCHARGE; MICRODISCHARGES; PLANAR ELECTRODE; PLANAR MICROSTRUCTURES; PLASMA MEASUREMENTS; PLASMA PROPERTIES; PULSED DC; QUARTZ SUBSTRATE; SENSITIVITY; TEMPERATURE COEFFICIENT;

ELECTRODES; HELIUM; ORGANIC POLYMERS; OXIDE MINERALS; PLASMA APPLICATIONS; PLASMA CONFINEMENT; PLASMA DEVICES; PRESSURE EFFECTS; PRESSURE SENSORS; PRESSURE TRANSDUCERS; QUARTZ; THREE DIMENSIONAL;

ELECTRIC DISCHARGES;

EID: 67549143807     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2017110     Document Type: Article

References (34)

1. R. Fielder, K. Stingson-Bagby, and M. Palmer, "State of the art in high-temperature fiber optic sensors," Proc. SPIE, vol. 5589, pp. 60-69, Dec. 2004.
2. D. C. Abeysinghe, S. Dasgupta, H. E. Jackson, and J. T. Boyd, "Novel MEMS pressure and temperature sensors fabricated on optical fibers," J. Micromech. Microeng., vol. 12, no. 3, pp. 229-235, Mar. 2002.
3. T. Li, Z. Wang, Q. Wang, X. Wei, B. Xu, W. Hao, F. Meng, and S. Dong, "High pressure and temperature sensing for the downhole applications," Proc. SPIE, vol. 6757, pp. 675 706-1-675 706-7, Oct. 2007.
4. A. Ned, R. Okojie, and A. Kurtz, "6H-SiC pressure sensor operation at 600 °C," in Proc. Int. High Temperature Electron. Conf., Albuquerque, NM, 1998, pp. 257-260.
5. S. Guo, H. Eriksen, K. Childress, A. Fink, and M. Hoffman, "High temperature high accuracy piezoresistive pressure sensor based on smart-cut SOI," in Proc. IEEE Int. Conf. Micro Electro Mech. Syst. Tucson, AZ, 2008, pp. 892-895.
6. S. Fricke, A. Friedberg, T. Ziemann, E. Rose, G. Muller, D. Telitschkin, S. Ziegenhagen, H. Seidel, and U. Schmidt, "High temperature (800 °C) MEMS pressure sensor development including reusable packaging for rocket engine applications," in Proc. Micro-Nano-Technol. Aerosp. Appl. CANEUS, Toulouse, France, 2006. 5p.
7. R. Foest,M. Schmidt, and K. Becker, "Microplasmas, an emerging field of low-temperature plasma science and technology," Int. J. Mass Spectrom., vol. 248, no. 3, pp. 87-102, Feb. 2006.
8. V. Karanassios, "Microplasmas for chemical analysis: Analytical tools or research toys?" Spectrochim. Acta B, At. Spectrosc., vol. 59, no. 7, pp. 909-928, Jul. 2004.
9. B. Mitra and Y. B. Gianchandani, "The detection of chemical vapors in air using optical emission spectroscopy of pulsed microdischarges from two- and three-electrode microstructures," IEEE Sensors J., vol. 8, no. 8, pp. 1445-1454, Aug. 2008.
10. M. Kushner, "Modelling of microdischarge devices: Plasma and gas dynamics," J. Phys. D, Appl. Phys., vol. 38, no. 11, pp. 1633-1643, May 2005.
11. C. G. Wilson, Y. B. Gianchandani, R. Arslanbekov, V. Kolobov, and A. Wendt, "Profiling and modeling of DC nitrogen microplasmas," J. Appl. Phys., vol. 94, no. 5, pp. 2845-2851, Sep. 2003.
12. C. Edelmann, "Measurement of high pressures in the vacuum range with the help of hot filament ionization gauges," Vacuum, vol. 41, no. 7-9, pp. 2006-2008, 1990.
13. S. A. Wright and Y. B. Gianchandani, "A harsh environment, multiplasma microsystem with pressure sensor, gas purifier, and chemical detector," in Proc. IEEE Int. Conf. Micro Electro Mech. Syst., Kobe, Japan, 2007, pp. 115-118.
14. S. A. Wright and Y. B. Gianchandani, "Microdischarge-based pressure sensors for operation at 1000 °C," in Proc. Solid-State Sens. Actuators Microsyst. Workshop, Hilton Head, SC, 2008, pp. 332-335.
15. S. A. Wright and Y. B. Gianchandani, "A micromachined quartz and steel pressure sensor operating upto 1000 °C and 2000 Torr," in Proc. IEEE Int. Conf. Micro Electro Mech. Syst., Sorrento, Italy, 2009, pp. 841-844.
16. D. Staack, B. Farouk, A. Gutsol, and A. Fridman, "Characterization of a DC atmospheric pressure normal glow discharge," Plasma Sources Sci. Technol., vol. 14, no. 4, pp. 700-711, Oct. 2005.
17. H. Rahanman, B. Lee, I. Petzenhauser, and K. Frank, "Switching characteristics of microplasmas in a planar electrode gap," Appl. Phys. Lett., vol. 90, no. 13, pp. 131 505-1-131 505-3, Mar. 2007.
18. J. Choi, K.Matsuo, H. Yoshida, T. Namihira, S. Katsuki, and H. Akiyama, "Characteristics of a dc-driven atmospheric pressure air microplasma jet," Jpn. J. Appl. Phys. 1, Regul. Pap. Short Notes, vol. 47, no. 8, pp. 6459-6463, Aug. 2008.
19. J. G. Eden and S.-J. Park, "Microcavity plasma devices and arrays: A new realm of plasma physics and photonic applications," Plasma Phys. Control. Fusion, vol. 47, no. 12B, pp. B83-B92, Nov. 2005.
20. J. Choi, F. Iza, J. K. Lee, and C. Ryu, "Electron and ion kinetics in a DC microplasma at atmospheric pressure," IEEE Trans. Plasma Sci., vol. 35, no. 5, pp. 1274-1278, Oct. 2007.
21. Y. J. Hong, S. M. Lee, G. C. Kim, and J. K. Lee, "Modeling high-pressure microplasmas: Comparison of fluid modeling and particle-in-cell Monte Carlo collision modeling," Plasma Process. Polym., vol. 5, no. 6, pp. 583-592, 2008.
22. M. A. Lieberman and A. J. Lichtenburg, Principles of Plasma Discharges and Materials Processing. New York: Wiley, 1994.
23. J. P. Boeuf, L. C. Pitchford, and K. H. Schoenbach, "Predicted properties of microhollow cathode discharges in xenon," Appl. Phys. Lett., vol. 86, no. 7, pp. 071 501-1-071 501-3, Feb. 2005.
24. M. Moselhy, I. Petzenhauser, K. Frank, and K. H. Schenbach, "Excimer emission from microhollow cathode argon discharges," J. Phys. D, Appl. Phys., vol. 36, no. 23, pp. 2922-2927, Nov. 2003.
25. R. T. Robiscoe and Z. Sui, "Circuit model of surface arcing," J. Appl. Phys., vol. 64, no. 9, pp. 4364-4374, Nov. 1988.
26. R. T. Robiscoe, A. Kadish, and W. B. Maier, II, "A lumped circuit model for transient arc discharges," J. Appl. Phys., vol. 64, no. 9, pp. 4355-4363, Nov. 1988.
27. S. G. Walton, J. C. Tucek, R. L. Champion, and Y. Wang, "Low energy, ion-induced electron and ion emission from stainless steel: The effect of oxygen coverage and the implications for discharge modeling," J. Appl. Phys., vol. 85, no. 3, pp. 1832-1837, Feb. 1999.
28. D. M. Allen, "The state of the art of photochemical machining at the start of the twenty-first century," Proc. Inst. Mech. Eng. B, J. Eng. Manuf., vol. 217, no. 5, pp. 643-650, 2003.
29. C. G. Wilson and Y. B. Gianchandani, "Silicon micromachining using in situ DC microplasmas," J. Microelectromech. Syst., vol. 10, no. 1, pp. 50-54, Mar. 2001.
30. S. T. Cho, K. Najafi, C. E. Lowman, and K. D. Wise, "An ultrasensitive silicon pressure-based microflow sensor," IEEE Trans. Electron Devices, vol. 39, no. 4, pp. 825-835, Apr. 1992.
31. Y. Zhang and K. D. Wise, "Performance of nonplanar silicon diaphragms under large deflections," J. Microelectromech. Syst., vol. 3, no. 2, pp. 59- 68, Jun. 1994.
32. The MEMS Handbook, 2nd ed. M. Gad-el-Hak, Ed. Boca Raton, FL: CRC Press, 2006.
33. C. Schrader, P. Sichler, L. Baars-Hibbe, N. Lucas, A. Schenk, S. Draeger, K.-H. Gericke, and S. Buttgenbach, "Micro-structured electrode arrays: Plasma based sterilization and coating over a wide pressure range," Surf. Coat. Technol., vol. 200, no. 1-4, pp. 655-659, Oct. 2005.
34. A. Rizk and L. Holland, "Sputtering and chemical etching of carbon in a DC glow discharge," Vacuum, vol. 27, no. 10/11, pp. 601-604, 1977.