High temperature (800°C) MEMS pressure sensor development including reusable packaging for rocket engine applications

Proceedings of MNT for Aerospace Applications, CANEUS2006

Volumn 2006, Issue , 2006, Pages

  Fricke, Sören ^a   Friedberger, Alois ^b   Ziemann, Thomas ^b   Rose, Eberhard ^b   Müller, Gerhard ^b   Telitschkin, Dimitri ^b   Ziegenhagen, Stefan ^b   Seidel, Helmut ^a   Schmid, Ulrich ^a  

^a SAARLAND UNIVERSITY   (Germany)

^b AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; PRESSURE MEASUREMENT; ROCKET ENGINES; THERMAL EXPANSION;

ADAPTIVE LAYERS; MINIATURIZED SENSOR ELEMENTS; PRESSURE SENSORS; TECHNOLOGICAL EFFORTS;

MICROSENSORS;

EID: 33845750239     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/caneus2006-11042     Document Type: Conference Paper

References (4)

1. A. Friedberger, S. Fricke, T. Ziemann, E. Rose, G. Müller, D. Telitschkin, S. Ziegenhagen, H. Seidel, U. Schmid, Reusable Packaging for High Temperature (800°C) and High Pressure MEMS, HiTEC 2006
2. S. Kimura, Y. Ishikura, T. Kataoka, M. Soeda, T. Masuda, Y. Yoshikawa, M. Nagata, Stable and Corrosion-Resistant Sapphire Capacitive Pressure Sensor for High Temperature and Harsh Environments, Transducers '01
3. J. Spannhake, Ö. Schulz, A. Helwig, A. Krenkow, G. Müller, T. Doll, High-temperature MEMS Heater Platforms: Long-term Performance of Metal and Semiconductor Heater Materials, Sensors 2006, 6, 405-419
4. 2 thin films as possible candidates for high temperature strain gauges, Sensors and Actuators (2005)