High temperature high accuracy piezoresistive pressure sensor based on SMART-CUT SOI

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 892-895

  Guo, Shuwen ^a   Eriksen, Harald ^a   Childress, Kimiko ^a   Fink, Anita ^a   Hoffman, Mary ^a  

^a Advanced Sensors Technical Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; CURVE FITTING; ELECTRONIC EQUIPMENT MANUFACTURE; HIGH TEMPERATURE APPLICATIONS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NONMETALS; NUMERICAL ANALYSIS; PHOTORESISTS; PRESSURE; PRESSURE SENSORS; PRESSURE TRANSDUCERS; REACTIVE ION ETCHING; SENSORS; SILICON; SINGLE CRYSTALS; THICK FILMS; WATER SUPPLY TUNNELS;

BULK SILICON; CURVE FITTING TECHNIQUE; HIGH PRESSURE; HIGH TEMPERATURE; HIGH-ACCURACY; HIGH-TEMPERATURE ENVIRONMENTS; INTERNATIONAL CONFERENCES; LOW PRESSURE; MAXIMUM TEMPERATURE; MICRO-ELECTRO MECHANICAL SYSTEMS; MONOTONICALLY; ON-CHIP TEMPERATURE; PIEZORESISTIVE PRESSURE; RESISTANCE VALUES; SINGLE-CRYSTAL-SILICON; SMART-CUT; SOI WAFERS; TWO TYPES; ULTRA-THIN FILM;

SILICON WAFERS;

EID: 50149111575     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443800     Document Type: Conference Paper

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