Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 28, Issue 6, 2009, Pages 846-859

  Han, Ki Jin ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bonding wires; Cylindrical conduction mode basis function (CMBF); Electric field integral equation (EFIE); Partial element equivalent circuit (PEEC) method; Proximity effect (PE); Skin effect (SE); System in package (SIP); Through hole via (THV) interconnections

Indexed keywords

BONDING WIRES; CYLINDRICAL CONDUCTION-MODE BASIS FUNCTION (CMBF); ELECTRIC FIELD INTEGRAL EQUATION (EFIE); PARTIAL ELEMENT EQUIVALENT CIRCUIT (PEEC) METHOD; PROXIMITY EFFECT (PE); SYSTEM-IN-PACKAGE (SIP); THROUGH-HOLE VIA (THV) INTERCONNECTIONS;

CELLULAR RADIO SYSTEMS; ELECTRIC CONDUCTORS; ELECTRIC FIELDS; ELECTRIC NETWORK ANALYSIS; EQUIVALENT CIRCUITS; INDUCTANCE; INTEGRAL EQUATIONS; INTERNET PROTOCOLS; PHYSICAL OPTICS; SKIN; SPONTANEOUS EMISSION; SYSTEMS ANALYSIS; WIRE;

THREE DIMENSIONAL;

EID: 66549096228     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2009.2016642     Document Type: Article

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