Analysis of ground bond wire arrays for RFICs

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1997, Pages 237-240

  Patterson, H ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTER SIMULATION;

WIRE ARRAYS;

ELECTRIC GROUNDING;

EID: 0031370030     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)