Triple-chip stacked CSP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 385-389

  Fukui, Yasuki ^a   Yano, Yuji ^a   Juso, Hiroyuki ^a   Matsune, Yuji ^a   Miyata, Koji ^a   Narai, Atsuya ^a   Sota, Yoshiki ^a   Takeda, Yoshikazu ^a   Fujita, Kazuya ^a   Kada, Morihiro ^a  

^a SHARP CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; DATA STORAGE EQUIPMENT; LSI CIRCUITS; MICROPROCESSOR CHIPS; RELIABILITY; SURFACE MOUNT TECHNOLOGY;

CHIP SIZE PACKAGE; SOLDER BALLS; WIRE BONDING;

CHIP SCALE PACKAGES;

EID: 0034482702     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)