Electromagnetic simulation of bonding wires and comparison with wide band measurements

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 1, 2000, Pages 69-79

  Schuster, Christian ^a   Leonhardt, Goötz ^a   Fichtner, Wolfgang ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; ELECTRIC WIRE; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; MONTE CARLO METHODS; TIME DOMAIN ANALYSIS;

BONDING WIRES; FINITE DIFFERENCE TIME DOMAIN (FDTD) SIMULATION;

ELECTRONICS PACKAGING;

EID: 0033877932     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.826764     Document Type: Article

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