Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers

Volumn , Issue , 2002, Pages 326-333

  Daniel, Luca ^a   Sangiovanni Vincentelli, Alberto ^b   White, Jacob ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Interconnect analysis; Parasitic extraction; Proximity effect; Skin effect

Indexed keywords

ELECTROMAGNETIC ANALYSIS PROGRAM; INTERCONNECT ANALYSIS; MIXED POTENTIAL INTEGRAL EQUATION; PARASITIC EXTRACTION; PROXIMITY EFFECT;

ALGORITHMS; COMPUTER SIMULATION; DATA STORAGE EQUIPMENT; ELECTRIC CURRENT DISTRIBUTION; ELECTRONICS PACKAGING; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; PROBLEM SOLVING; RESPONSE TIME (COMPUTER SYSTEMS); SKIN EFFECT;

INTEGRATED CIRCUIT TESTING;

EID: 0036907050     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/774572.774621     Document Type: Conference Paper

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