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Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 392-399

Radio frequency characterization of bonding wire interconnections in a molded chip

(3) Chuang, Jun Yi a Tseng, Sung Pi a Yeh, J Andrew a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; CROSSTALK; ELECTRIC RESISTANCE; FREQUENCIES; INTERCONNECTION NETWORKS; MONTE CARLO METHODS;

BONDING WIRE INTERCONNECTIONS; IMPEDANCE MATCHING; RADIO FREQUENCY CHARACTERIZATION; SIGNAL WIRES;

ELECTRIC WIRE;

EID: 10444222545 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (8)

References (7)

1
- 0029208581
- Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits
- Jan.
- H. Y. Lee, "Wideband Characterization of a Typical Bonding Wire for Microwave and Millimeter-wave Integrated Circuits," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 63-68, Jan. 1995
- (1995) IEEE Trans. Microwave Theory Tech. , vol.43 , pp. 63-68
- Lee, H.Y.¹

2
- 0029379296
- Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging
- Sep.
- S. K. Yun, H. Y. Lee, "Parasitic Impedance Analysis of Double Bonding Wires for High-Frequency Integrated Circuit Packaging," IEEE Microwave and Guided Wave Lett., vol. 5, pp. 296-298, Sep. 1995
- (1995) IEEE Microwave and Guided Wave Lett. , vol.5 , pp. 296-298
- Yun, S.K.¹ Lee, H.Y.²

3
- 0033877932
- Electromagnetic simulation of bonding wires and comparison with wide band measurements
- Feb.
- C. Schuster, G. Leonhardt, W. Fichtner, "Electromagnetic Simulation of Bonding Wires and Comparison with Wide Band Measurements," IEEE Trans. Advanced Packaging, vol. 23, pp. 69-79, Feb. 2000
- (2000) IEEE Trans. Advanced Packaging , vol.23 , pp. 69-79
- Schuster, C.¹ Leonhardt, G.² Fichtner, W.³

4
- 0035521170
- Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects
- Nov.
- A. Sutono, N. G. Cafaro, J. Laskar, and M. M. Tentzeris, "Experimental Modeling, Repeatability Investigation and Optimization of Microwave Bond Wire Interconnects," IEEE Trans. Advanced Packaging, vol. 24, pp. 595-603, Nov. 2001
- (2001) IEEE Trans. Advanced Packaging , vol.24 , pp. 595-603
- Sutono, A.¹ Cafaro, N.G.² Laskar, J.³ Tentzeris, M.M.⁴

5
- 0037674330
- RF evaluation of low-cost leadless packages and development of distributed electrical models
- New Orleans, LA, June
- th Electronic Components and Technology Conf, New Orleans, LA, June. 2003, pp. 1550-1558
- (2003) th Electronic Components and Technology Conf , pp. 1550-1558
- Chandrasekhar, A.¹ Brebels, S.² Beyne, E.³

6
- 0034239151
- A fast 3-D modeling approach to electrical parameters extraction of bonding wires for RF circuits
- August
- Xiaoning Qi, Patrick Yue, Torkel Amborg, Hyongsok T. Soh, Hiroyuki Sakai, Zhiping Yu, Robert W. Dutton, "A Fast 3-D Modeling Approach to Electrical Parameters Extraction of Bonding Wires for RF Circuits," IEEE Trans. Advanced Packaging, vol. 23, pp.484, August 2000
- (2000) IEEE Trans. Advanced Packaging , vol.23 , pp. 484
- Qi, X.¹ Yue, P.² Amborg, T.³ Soh, H.T.⁴ Sakai, H.⁵ Zhiping, Y.⁶ Dutton, R.W.⁷

7
- 0034818603
- Modeling and characterization of the bonding-wire nterconnection
- Jan.
- Federico Alimenti, Paolo Mezzanotte, and Roberto Sorrentino, "Modeling and Characterization of the Bonding-Wire nterconnection" IEEE Trans. Microwave Theory Tech., vol. 49, Jan. 2001
- (2001) IEEE Trans. Microwave Theory Tech. , vol.49
- Alimenti, F.¹ Mezzanotte, P.² Sorrentino, R.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.