Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

Proceedings - Design Automation Conference

Volumn , Issue , 2008, Pages 421-424

  Han, Ki Jin ^a   Swaminathan, Madhavan ^a   Engin, Ege ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3 D integration; Conduction mode basis function; Electric field integral equation; Proximity effect; Skin effect; Systemin package

Indexed keywords

3-D INTEGRATION; CONDUCTION MODE BASIS FUNCTION; ELECTRIC FIELD INTEGRAL EQUATION; PROXIMITY EFFECT; SKIN EFFECT; SYSTEMIN-PACKAGE;

COMPUTER AIDED DESIGN; DIGITAL INTEGRATED CIRCUITS; ELECTRIC FIELD EFFECTS; ELECTRIC FIELDS; HEAT CONDUCTION; INDUSTRIAL ENGINEERING; PHYSICAL OPTICS;

INTEGRAL EQUATIONS;

EID: 51549121395     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DAC.2008.4555854     Document Type: Conference Paper

References (7)

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