Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling

Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science

Volumn 223, Issue 4, 2009, Pages 953-963

  Verma, P ^a   Chatterjee, D ^a   Nagarajan, T ^a,b  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

^b DEPARTMENT OF CHEMICAL ENGINEERING   (Malaysia)

Author keywords

Heat sink; Integrated cooling; Modular; Piezoelectric; Printed circuit board; Valveless micropump

Indexed keywords

CONICAL DIFFUSERS; CONTROL ELECTRONICS; DESIGN AND DEVELOPMENT; ELECTRONIC COOLING; FLUIDIC COMPONENTS; INPUT VOLTAGES; INTEGRATED COOLING; INTEGRATED THERMAL MANAGEMENT SYSTEMS; MAXIMUM FLOWRATE; MAXIMUM POWER; MICRO PUMPS; MINI CHANNELS; MODULAR; MODULAR UNITS; PIEZOELECTRIC; PIEZOELECTRIC ACTUATIONS; POWER LEVELS; PRESSURE HEADS; PULSATING FLOWS; SIGNAL CONDITIONING; SURFACE TEMPERATURES; VALVELESS MICROPUMP; WORKING FLUIDS;

COOLING; COOLING SYSTEMS; ELECTROMAGNETIC WAVE EMISSION; ETHANOL; HEAT SINKS; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PUMPS; TEMPERATURE CONTROL;

PRINTED CIRCUIT BOARDS;

EID: 64549162388     PISSN: 09544062     EISSN: None     Source Type: Journal    
DOI: 10.1243/09544062JMES1315     Document Type: Article

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