A novel valveless micropump with electrohydrodynamic enhancement for high heat flux cooling

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 216-230

  Singhal, Vishal ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Electronics cooling; Induction electrohydrodynamics (EHD); Microchannels; Micropumps; Nozzle diffuser action; Valveless pumping

Indexed keywords

ELECTROHYDRODYNAMICS; HEAT FLUX; HEAT SINKS; MATHEMATICAL MODELS; NUMERICAL METHODS;

ELECTRONICS COOLING; INDUCTION ELECTROHYDRODYNAMICS; MICROCHANNELS; MICROPUMPS; NOZZLE DIFFUSER ACTION; VALVELESS PUMPING;

COOLING SYSTEMS;

EID: 20444403366     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.847430     Document Type: Article

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