Lead-free and PbSn bump electromigration testing

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1313-1321

  Gee, Stephen ^a   Kelkar, Nikhil ^a   Huang, Joanne ^b   Tu, King Ning ^b  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Electromigration; Eutectic PbSn; Lead Free; SnAgCu; Temperature Sensor

Indexed keywords

CURRENT DENSITY; ELECTRONICS INDUSTRY; EUTECTICS; LEAD ALLOYS; METALLIZING; TIN ALLOYS;

EUTECTIC PBSN; LEAD FREE; SNAGCU; TEMPERATURE SENSOR;

ELECTROMIGRATION;

EID: 32844464918     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73417     Document Type: Conference Paper

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