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Volumn 101, Issue 2, 2007, Pages
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Theoretical analysis of current-driven interactions between voids in metallic thin films
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Author keywords
[No Author keywords available]
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Indexed keywords
ANISOTROPIC MATERIALS;
ELECTROMIGRATION TESTING;
METALLIC INTERCONNECT LINES;
METALLIC THIN FILMS;
ANISOTROPY;
DIRECT NUMERICAL SIMULATION;
ELECTRIC RESISTANCE;
ELECTROMIGRATION;
THIN FILMS;
METALLIC FILMS;
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EID: 33847735488
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2426901 Document Type: Article |
Times cited : (13)
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References (26)
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