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Volumn 101, Issue 4, 2007, Pages

Statistical analysis of electromigration lifetimes and void evolution

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION LIFETIMES; GEOMETRICAL VARIATIONS; SIGMA VALUES; STATISTICAL CORRELATION; VOID SIZES;

EID: 33847614307     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2655531     Document Type: Article
Times cited : (39)

References (22)
  • 1
    • 85013613367 scopus 로고    scopus 로고
    • Proceedings of IEEE International Interconnect Technology Conference
    • C.-K. Hu, R. Rosenberg, H. S. Rathore, D. B. Nguyen, and B. Agarwala, Proceedings of IEEE International Interconnect Technology Conference, 267 (1999).
    • (1999) , vol.267
    • Hu, C.-K.1    Rosenberg, R.2    Rathore, H.S.3    Nguyen, D.B.4    Agarwala, B.5
  • 9
    • 33847668092 scopus 로고    scopus 로고
    • Proceedings of Materials for Advanced Metallization Conference, Brussels
    • M. A. Meyer, M. Grafe, H. J. Engelmann, and E. Zschech, Proceedings of Materials for Advanced Metallization Conference, Brussels, 2004.
    • (2004)
    • Meyer, M.A.1    Grafe, M.2    Engelmann, H.J.3    Zschech, E.4
  • 15
    • 33847634961 scopus 로고    scopus 로고
    • Ph.D. dissertation, UT Austin
    • M. Hauschildt, Ph.D. dissertation, UT Austin, 2005.
    • (2005)
    • Hauschildt, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.