Microstructure Changes in Sn-Zn/Cu Joints During Heat-Exposure

Journal of The Japan Institute of Electronics Packaging

Volumn 5, Issue 7, 2002, Pages 666-671

  Kim, Keun Soo ^a   Kim, Young Sun ^a   Suganuma, Katsuaki ^a   Nakajima, Hideo ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Cu5Zn8; Heat Exposure; Lead Free; Sn Zn Solder

Indexed keywords

EID: 85009648553     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.5.666     Document Type: Article

References (13)

1. K. Suganuma, T. Murata, H. Noguchi and Y. Toyota :“Heat Resistance of Sn-9Zn Solder/Cu Interface with or without Coating”, J. Mater. Res., Vol. 15, pp. 884-891, 2000.
2. K. Young-Sun, C. W. Hwang and K. Suganuma :“Interface Microstructure of Sn-Zn-Bi Solder/Sn-lOPb Plating/Cu and High Temperature Stability”, International Conf. On Electronics Packaging (2001 ICEP), Tokyo, April 18-20, pp. 84-87, 2001.
3. B. F. Dyson, T. R. Anthony and D. Turnbull:“Interstitial Diffusion of Copper in Tin”, J. Appl. Phys., Vol. 38, p. 3408, 1967.
4. F. H. Huang and H. B. Huntington :“Diffusion of Sb124, Cd109, Sn113, and Zn65 in Tin”, Phys. Rev., 9B, pp. 1479-1488, 1974.
5. K. Hoshino, Y. Jijima and K. Hirano:“In ter diffusion and Kirkendall Effect in Cu-Sn Alloys”, Trans. JIM., Vol. 21, pp. 674-682, 1980.
6. W. K. Choi and H. M. Lee I“Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface between Molten Sn-3. 5Ag and Ni/Cu Substrate”, J. Electron. Mater., Vol. 28, pp. 1251-1255, 1999.
7. W. K. Choi and H. M. Lee :“Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of Intermetallic Compounds between Sn-3. 5Ag Solder Alloy and Cu Substrate”, J. Electron. Mater., Vol. 29, pp. 1207-1213, 2000.
8. S. W. Yoon, W. K. Choi and H. M. Lee :“Interfacial Reaction between Sn-lBi-5In-9Zn Solder and Cu Substrate”, Scripta Mat., Vol. 40, pp. 327-332, 1999.
9. R. Kao, A. Bolcavage and Y. A. Chang :“Application of Thermodynamics in the Synthesis and Processing of Materials”, ed. P. Nash and B. Sundman, Warrendale, PA: TMS, pp. 141, 1995.
10. H. M. Lee, S. W. Yoon and B. J. Lee :“Thermodynamic Prediction of Interface Phases at Cu/Solder Joints”, J. Electron. Mater., Vol. 27, pp. 1161-1166, 1998.
11. S. P. Yu, H. J. Lin, M. H. Hon and M. C. Wang :“Effects of Process Parameters on the Soldering Behavior of the Eutectic Sn-Zn Solder on Cu Substrate”, J. Mat. Sci.-Mater. in Electon., Vol. 11, pp. 461-471, 2000.
12. S. P. Yu, M. C. Wang and M. H. Hon :“Formation of Intermetallic Compounds at Eutectic Sn-Zn-Al Solder/Cu Interface”, J. Mater. Res., Vol. 16, No. 1, pp. 76-82, 2001.
13. M. Onishi and H. Fujibuchi :“Reaction-Diffusion in the Cu-Sn System”, Trans. JIM., Vol. 16, pp. 539-547, 1975.