Effect of pinhole Au/Ni/Cu substrate on self-alignment of advanced packages

Materials Science and Engineering: B

Volumn 76, Issue 2, 2000, Pages 87-94

  Hung, K C ^a   Chan, Y C ^a   Ong, H C ^a   Tu, P L ^a   Tang, C W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Advanced packages ( BGA); Pinhole Au Ni Cu substrate; Self alignment

Indexed keywords

EID: 0347740313     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(00)00413-X     Document Type: Article

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