Reliability of solder joint with Sn-Ag-Cu-Ni-Ge lead-free alloy under heat exposure conditions

Materials Transactions

Volumn 46, Issue 12, 2005, Pages 2737-2744

  Shohji, Ikuo ^a   Tsunoda, Satoshi ^a   Watanabe, Hirohiko ^b   Asai, Tatsuhiko ^b   Nagano, Megumi ^b  

^a GUNMA UNIVERSITY   (Japan)

^b FUJI ELECTRIC CO   (Japan)

Author keywords

Ball shear strength; Growth kinetics; Lead free solder; Microstructure; Tin silver copper nickel germanium

Indexed keywords

BAL SHEAR STRENGTH; LEAD FREE SOLDERS;

GROWTH KINETICS; INTERFACES (MATERIALS); MICROSTRUCTURE; SURFACE TREATMENT; TIN ALLOYS;

SOLDERED JOINTS;

EID: 32344447163     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2737     Document Type: Conference Paper

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