The Constitutive Creep Equation for a Eutectic Sn-Ag Alloy Using the Modified Theta-Projection Concept

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1398-1402

  Kariya, Yoshiharu ^a   Otsuka, Masahisa ^b   Plumbridge, William J ^c  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

^c OPEN UNIVERSITY   (United Kingdom)

Author keywords

Constitutive equation; Creep; Lead free solder; Nonsteady state; Sn 3.5Ag; projection

Indexed keywords

ACTIVATION ENERGY; CREEP; DEFORMATION; ELASTIC MODULI; EUTECTICS; HARDENING; MICROSTRUCTURE; RATE CONSTANTS; SILVER ALLOYS; SOLDERED JOINTS; STRAIN RATE; STRESSES; THERMAL EFFECTS;

CONSTITUTIVE EQUATIONS; LEAD-FREE SOLDERS; NONSTEADY STATE; SN-3.5AG;

TIN ALLOYS;

EID: 0942288661     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0107-1     Document Type: Conference Paper

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