Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder

Journal of The Japan Institute of Electronics Packaging

Volumn 8, Issue 6, 2005, Pages 495-501

  Nagano, Megumi ^a   Hidaka, Noboru ^a   Shimoda, Masayoshi ^a   Ono, Masahiro ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

Aging Treatment; Lead Free Solder; Microstructure; Sn Ag Cu Ni Ge Solder; Tensile Behavior

Indexed keywords

EID: 85009589367     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.8.495     Document Type: Article

References (2)

1. M. Nagano, N. Hidaka, M. Shimoda and H. Watanabe: “Effect of Germanium Content on Oxidation Prevention of Sn-Ag-Cu Lead-Free Solder”, Proc. of PSEA04, pp. 256-261, 2004.
2. R. W. G. Wyckoff: “Crystal Structure”, Interscience Publisher, New York, Vol. 1, p. 28, 1963.