Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder

journal of the japan institute of Electronics Packaging

Volumn 9, Issue 3, 2006, Pages 171-179

  Nagano, Megumi ^a   Hidaka, Noboru ^a   Watanabe, Hirohiko ^a   Shimoda, Masayoshi ^a   Ono, Masahiro ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

Creep Property; Dislocation; Lead Free Solder; Microstructure; Sn 3. 5Ag 0. 5Cu Ni Ge Solder; Stacking Fault

Indexed keywords

EID: 85009635319     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.9.171     Document Type: Article

References (7)

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