Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 860-866

  Babaghorbani, P ^a   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Densification; Lead free solder; Microwave sintering; Tensile properties

Indexed keywords

LEAD-FREE SOLDERS; MECHANICAL RESPONSE; MICROWAVE SINTERING;

CHARACTERIZATION; DENSIFICATION; ENERGY EFFICIENCY; FRACTURE; INTERMETALLICS; MICROSTRUCTURE; MICROWAVES; SINTERING; TENSILE STRENGTH;

SOLDERING ALLOYS;

EID: 42449115705     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0399-2     Document Type: Article

References (33)

1. S. Kang, A. Sarkhel, JOM 23, 701 (1994)
2. P.T. Vianco, D.R. Frear, JOM 7, 14 (1993)
3. M. Abtew, G. Selvaduray, Mater. Sci. Eng. 27, 95 (2000)
4. J. Glazer, Intl. Mater. Rev. 40, 65 (1995)
5. W.J. Plumbridge, C.R. Gagg, J. Mater. Des. Appl. (Part L) 214, 153 (2000)
6. R.M. German, Powder Metallurgy Science. (USA: Metal Powder Industries Federation, (1984))
7. J.P. Schaffer, A. Saxena, S.D. Antolovich, T.H. Sanders, S.B. Warner, The Science and Design of Engineering Materials. 2nd ed. (New York: McGraw-Hill, (1999))
8. R. Roy, D.K. Agrawal, and J. Cheng, U.S. patent 6,183,689 B1 (2001)
9. S. Leparoux, S. Vaucher, O. Beffort, Adv. Eng. Mater. 5, 449 (2003)
10. G. Sethi, A. Upadhyaya, D.K. Agrawal, Sci. Sintering 35, 49 (2003)
11. M. Gupta, W.L.E. Wong, Scripta Mater. 52, 479 (2005)
12. W.L.E. Wong, S. Karthik, M. Gupta, Mater. Sci. Tech. 21, 1063 (2005)
13. S.S. Panda, V. Singh, A. Upadhyaya, D.K. Agrawal, Scripta Mater. 54, 2179 (2006)
14. A. Upadhyaya, G. Sethi, Scripta Mater. 54, 469 (2007)
15. W.L.E. Wong, M. Gupta, Compos. Sci. Technol. 67, 1541 (2007)
16. K.S. Tun, M. Gupta, Compos. Sci. Technol. 67, 2657 (2007)
17. R. Roy, J. Cheng, and D.K. Agrawal, U.S. patent 6,365,885 B1 (2002)
18. Y. Tomita, M. Tago, Y. Nemoto, and K. Takahashi, Electronic Mater. Pack., EMAP 2001, (19-22 November 2001), p. 107
19. P.H. Lawyer, D. Choudhury, M.D. Wetzel, and D.B. Rensch, Electro. Manuf. Tech. Sym. 23rd IEEE/CPMT (19-21 October 1998), p. 390
20. B.C. Kim, J.H. Kim, J.H. Lee, C.D. Yoo, D.S. Choi, J. Kor. Weld. Soc. 22, 258 (2004)
21. J.M. Kim, J.P. Jung, Y.N. Zhou, and J.Y. Kim, J. Electron. Mater. 37(3), 324 (2008)
22. R.A. Saravanan, M.K. Surappa, Mater. Sci. Eng. A 276, 108 (2000)
23. R.M. German, Sintering Theory and Practice. (New York: John Wiley (1996))
24. S.S. Panda, A. Upadhyaya, D.K. Agrawal, J. Mater. Sci. 42, 966 (2007)
25. M.A. Meyers, K.K. Chawla, Mechanical Behaviour of Materials, (Saddle River, NJ: Prentice Hall (1999))
26. Q. Zhang, D.L. Chen, Scripta Mater. 51, 863 (2004)
27. Z. Zhang, D.L. Chen, Scripta Mater. 54, 1321 (2006)
28. P.D. Ramesh, K.J. Rao, Bull. Mater. Sci. 18, 447 (1995)
29. P. Yadoji, R. Peelamedu, D.K. Agrawal, R. Roy, Mater. Sci. Eng. B 98, 269 (2003)
30. R. Roy, D.K. Agrawal, J. Cheng, S. Gedevanishvili, Nature 399, 668 (1999)
31. Y.N. Yu, Theory of Metal. (Beijing: Metallurgical Industry, (2003))
32. X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Acta Mater. 52, 4291 (2004)
33. J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, H.X. Gao, Mater. Sci. Eng. A 441, 135 (2006)