Thermomechanical response of a lead-free solder reinforced with a shape memory alloy

Scripta Materialia

Volumn 54, Issue 4 SPEC. ISS., 2006, Pages 627-632

  Wang, Z X ^a,c   Dutta, I ^b   Majumdar, B S ^a  

^a NEW MEXICO INSTITUTE OF MINING AND TECHNOLOGY   (United States)

^b Naval Postgraduate School ^*  (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Creep; Double shear testing; Lead free solder; NiTi; Shape memory alloy; Thermomechanical fatigue

Indexed keywords

COMPOSITE MATERIALS; CREEP; FATIGUE OF MATERIALS; SHAPE MEMORY EFFECT; SOLDERED JOINTS; THERMOMECHANICAL TREATMENT;

DOUBLE-SHEAR TESTING; LEAD-FREE SOLDER; NITI; THERMOMECHANICAL FATIGUE;

SOLDERING ALLOYS;

EID: 28644433484     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.10.037     Document Type: Article

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