An active micro joining mechanism for 3D assembly

Journal of Micromechanics and Microengineering

Volumn 19, Issue 3, 2009, Pages

  Mayyas, Mohammad ^a   Zhang, Ping ^a   Lee, Woo Ho ^a   Popa, Dan ^a,b   Chiao, J C ^b  

^a UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

^b University of Texas at Arlington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ELECTRON BEAM LITHOGRAPHY; JOINING; MICROSTRUCTURE; REACTIVE ION ETCHING; SILICON WAFERS; TIN;

BENT BEAMS; CONTACT AREAS; DEEP REACTIVE ION ETCHINGS; DEPOSITED LAYERS; DESIGN CONCEPTS; ELECTRICAL CHARACTERISTICS; LOCKING MECHANISMS; MICRO PARTS; MICRO-JOINING; SELF ALIGNMENTS; SOI WAFERS; SOLDER ALLOYS; SYSTEM ON CHIPS;

MECHANISMS;

EID: 61849088498     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/3/035012     Document Type: Article

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