Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 1, 2009, Pages 123-129

  Li, Yi ^a   Yim, Myung Jin ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Adhesives; Contact resistance; Fine pitch capability; Interconnects; Sintering

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CONTACT RESISTANCE; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; ORGANIC POLYMERS; SILVER; SINTERING;

AFTER HIGH TEMPERATURES; BONDING PRESSURES; CURRENT CARRYING CAPABILITIES; ELECTRICAL CONDUCTIONS; ELECTRICAL PERFORMANCE; FINE PITCH CAPABILITY; FINE PITCHES; HIGH FREQUENCIES; HUMIDITY TESTS; INTERCONNECTS; JOINT RESISTANCES; LOW-TEMPERATURE SINTERING; MICROELECTRONICS PACKAGING; NANO SILVERS; NANO-SCALE; ORDERS OF MAGNITUDES; PACKAGING APPLICATIONS; ULTRA-FINE PITCHES; Z DIRECTIONS;

CONDUCTIVE FILMS;

EID: 61649100096     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2003428     Document Type: Article

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