Tradeoffs in modeling the response of power delivery systems of high-performance microprocessors

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 77-80

  Beker, Benjamin ^a   Hirsch, Tom ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTATIONAL GEOMETRY; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK SYNTHESIS; ELECTRIC POWER DISTRIBUTION; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICE MODELS;

CERAMIC PIN GRID ARRAYS (CPGA); HIGH-PERFORMANCE MICROPROCESSORS;

MICROPROCESSOR CHIPS;

EID: 0034497816     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)