Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 81-88

  Hsiao, L I Yin ^a   Kao, Szu Tsung ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electroless Ni P; Intermetallic compound; Phase transformation; Sn3.0Ag0.5Cu composite solder; Under bump metallization (UBM)

Indexed keywords

ELECTROLESS NI-P; SN3.0AG0.5CU COMPOSITE SOLDER; UNDER-BUMP METALLIZATION (UBM);

COMPOSITE MATERIALS; ELECTROLESS PLATING; MECHANICAL ALLOYING; METALLIZING; METALLURGY; SOLDERING ALLOYS;

TIN COMPOUNDS;

EID: 32644445532     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0188-8     Document Type: Conference Paper

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