Wafer-level BCB bonding using a thermal press for microfluidics

Microsystem Technologies

Volumn 15, Issue 4, 2009, Pages 573-580

  Zhou, Xiaodong ^a   Virasawmy, Selven ^b   Quan, Chenggen ^b  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; GLASS; POLYMERIC GLASS; PRESSES (MACHINE TOOLS); SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TENSILE STRENGTH; THERMOSETS; WAFER BONDING;

A THERMALS; BCB BONDINGS; BENZO CYCLO BUTENES; BONDING METHODS; BONDING PERCENTAGES; BONDING STRENGTHS; BOTTOM LAYERS; PRESSURE INCREMENTS; THERMOSETTING POLYMERS; THICK ELECTRODES; WAFER LEVELS;

GLASS BONDING;

EID: 58849143796     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0712-2     Document Type: Article

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