Micro bonding with non-viscous adhesives

Microsystem Technologies

Volumn 12, Issue 7, 2006, Pages 676-679

  Bohm S ^a   Dilger, K ^a   Hesselbach, J ^a   Wrege, J ^a   Rathmann, S ^a   Ma, W ^a   Stammen, E ^a   Hemken, G ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Adhesive technology; Batch process; Hot melts; MEMS; Pre applying

Indexed keywords

ADHESIVES; BONDING; JOINING; MACHINE COMPONENTS; MICROELECTROMECHANICAL DEVICES;

ADHESIVE TECHNOLOGY; BATCH PROCESS; HOT MELTS; MEMS; PRE-APPLYING;

MICROMACHINING;

EID: 33646931018     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0101-7     Document Type: Article

References (7)

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