Packaging methodology for RF devices using a BCB membrane transfer technique

Journal of Micromechanics and Microengineering

Volumn 16, Issue 11, 2006, Pages 2384-2388

  Seok, S ^a   Rolland, N ^a   Rolland, P A ^a  

^a UMR National Center for Scientific Research   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; SILICON WAFERS; THIN FILMS; WAVEGUIDES;

BENZOCYCLOBUTENE (BCB) FILMS; RF DEVICES; WAFER-SCALE MEMBRANE TRANSFER;

MICROELECTROMECHANICAL DEVICES;

EID: 33750588831     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/11/019     Document Type: Article

References (10)

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