Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

Soldering & Surface Mount Technology

Volumn 21, Issue 1, 2009, Pages 4-10

  Kim, KyooSeok ^a   Jung, JaePil ^a   Norman Zhou, Y ^b  

^a University of Seoul   (South Korea)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Bonding; Joining processes; Printed circuits

Indexed keywords

COPPER; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; EMISSION SPECTROSCOPY; FIELD EMISSION; INTERMETALLICS; JOINING; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; TEMPERATURE; TIN; ULTRASONICS;

AMBIENT TEMPERATURES; BONDED JOINTS; BONDING; BONDING PRESSURES; BONDING TIME; DESIGN/METHODOLOGY/APPROACH; FIELD EMISSION-SCANNING ELECTRON MICROSCOPIES; FLEXIBLE PRINTED CIRCUIT BOARDS; FRACTURE SURFACES; INTERMETALLIC COMPOUNDS; JOINING PROCESSES; MAXIMUM VALUES; MECHANICALLY ALLOYED; METAL PADS; METALLIZATION LAYERS; PAD ARRAYS; PULL TESTING; RIGID PRINTED CIRCUIT BOARDS; ROOM TEMPERATURES; SURFACE LAYERS; TRANSVERSE VIBRATIONS; ULTRASONIC BONDINGS; ULTRASONIC ENERGIES; ULTRASONIC FREQUENCIES;

PRINTED CIRCUIT BOARDS;

EID: 58849115480     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910928256     Document Type: Article

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