Comparative performance of gold wire bonding on rigid and flexible substrates

Journal of Materials Science: Materials in Electronics

Volumn 17, Issue 8, 2006, Pages 597-606

  Chan, Yu Hin ^a   Kim, Jang Kyo ^a   Liu, Deming ^b   Liu, Peter C K ^b   Cheung, Yiu Ming ^b   Ng, Ming Wai ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; METALLIZING; POLYIMIDES; SUBSTRATES; THERMAL EFFECTS; WIRE;

BISMALEIMIDETRAZINE; GOLD WIRE BONDING; ULTRASONIC ENERGY;

BONDING;

EID: 33746356210     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-0005-4     Document Type: Article

References (11)

1. R.D. Schueller, D. Aeschliman, C.T. Han, in Proc. IEEE EPTC, 1997, pp. 151-162
2. M. Karnezos, M. Goetz, F. Dong, A. Ciaschi, N. Chidambaram, in Proc. IEEE ECTC, 1966, pp. 1271-1277
3. E. Hall, A.M. Lyons and J.D. Weld, IEEE Trans. CPMT. Part A. 19, 12 (1996)
4. J.M. Nowful, S.C. Lok, in Proc. Int. Sym. Electron. Mater. Packag., 2001, pp. 39-43
5. D.W. Bushmire, P.H. Holloway, in Proc. Int. Sym. Microelectron, 1975, pp. 402-407
6. J.K. Nesheim, in Proc. 1984 Int. Sym. Microelectr, 1984, pp. 70-78
7. Y.H. Chan, J.K. Kim, D. Liu, P.C.K. Liu, Y.M. Cheng, M.W. Ng, J. Electron. Mater. 33, 146 (2004)
8. Y.H. Chan, J.K. Kim, D. Liu, P.C.K. Liu, Y.M. Cheng and M.W. Ng, IEEE Trans. CPMT Part B: Adv. Packaging 28, 674 (2005)
9. G.G. Harman, Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield, 2nd edn. (McGraw Hill, New York, 1997)
10. V. Murali, M. Gasparek, A. Bhansali, S.H. Chen, R. Dias, in Proc. IEEE IRPS, 1992, pp. 24-30
11. J.K. Kim and B.P.L. Au, J. Electron. Mater. 30, 1001 (2001)