Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards

Japanese Journal of Applied Physics

Volumn 47, Issue 5 PART 2, 2008, Pages 4300-4304

  Lee, Jong Bum ^a   Koo, Ja Myeong ^a   Hong, Soon Min ^b   Shin, Hyoyoung ^b   Moon, Young Jun ^b   Jung, Jae Pil ^c   Yoo, Choong Don ^d   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c University of Seoul   (South Korea)

^d Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Electroless Ni immersion Au (ENIG); Flexible printed circuit board (FPCB); Immersion Sn; Intermetallic compound (IMC); Peel test; Rigid printed circuit board (RPCB); Ultrasonic bonding

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTRODES; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; GOLD; INTERMETALLICS; LATTICE VIBRATIONS; PEELING; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SEMICONDUCTING INTERMETALLICS; SIGNAL INTERFERENCE; TIN; ULTRASONIC EFFECTS; ULTRASONIC WAVES; ULTRASONICS;

ELECTROLESS NI/IMMERSION AU (ENIG); FLEXIBLE PRINTED CIRCUIT BOARD (FPCB); IMMERSION SN; INTERMETALLIC COMPOUND (IMC); PEEL TEST; RIGID PRINTED CIRCUIT BOARD (RPCB); ULTRASONIC BONDING;

PRINTED CIRCUIT BOARDS;

EID: 54949126011     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.4300     Document Type: Article

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