Reducing bonding cycle time of adhesive flip chip process

Soldering and Surface Mount Technology

Volumn 15, Issue 1, 2003, Pages 16-20

  Seppälä, Anne ^a   Aalto, Kati ^a   Ristolainen, Eero ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Anisotropy; Cycle time; Flip chip; Reflow; Reliability

Indexed keywords

ADHESIVES; ANISOTROPY; BONDING; CONDUCTIVE MATERIALS; CURING; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; TEMPERATURE;

ADHESIVE FLIP CHIP PROCESS; CONTACT RESISTANCE; HIGH DENSITY INTERCONNECTION; REFLOW;

FLIP CHIP DEVICES;

EID: 0037216973     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310455671     Document Type: Article

References (7)

1. Hu, K., Yeh, C.P. and Wyatt,K. W. (1997), "Electro-thermo-mechanical responses of conductive adhesive materials", IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 20 No. 4, pp. 470-7.
2. Kristiansen, H. and Liu, J. (1998), "Overview of conductive adhesive interconnection technologies for LCDs", IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21 No. 2, pp. 208-14.
3. Miebner R., Aschenbrenner, R. and Reichl, H. (1998), "Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections", Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technology in Electronics, pp. 299-304.
4. Palm, P., Määttänen, J., Picault, A. and Maquillé, Y. (2001), "The evaluation of different base materials for high density flip chip on flex applications", Microelectronics International, Vol. 18 No. 3, pp. 27-31.
5. Seppälä A., Nurmi, S. and Ristolainen, E. (2001a), "Thermal shock resistance of adhesive flip chip joints", Proceedings of the 38th IMAPS Nordic Annual Conference, Oslo. pp. 287-91.
6. Seppälä, A., Suominen, I. and Ristolainen, E. (2001b), "A long-term reliability of adhesive flip chip joints using very thin chips", Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, pp. 196-201.
7. Yim, M.J. and Paik, K.W. (1999), "The contact resistance and reliability of anisotropically conductive film (ACF)", IEEE Transactions on Advanced Packaging, Vol. 22 No. 2, pp. 166-73.