Intermetallic growth between Sn-Ag-(Cu) solder and Ni

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 219-224

  Yang, Seung Taek ^a   Chung, Yoon ^a   Kim, Young Ho ^a   Hong, B H ^b   Park, K R ^b   Song, H G ^c   Moris, J W ^c  

^a Hanyang University   (South Korea)

^b Amkor Technology Korea Inc   (South Korea)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; NICKEL; PACKAGING MATERIALS; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

CU CONCENTRATIONS; CU-CONTAINING SOLDERS; ENERGY DISPERSIVE SPECTROSCOPIES (EDS); INTERMETALLIC FORMATION; INTERMETALLIC GROWTH; INTERMETALLIC PHASE; INTERMETALLIC THICKNESS; TERNARY COMPOUNDS;

TIN;

EID: 84960338477     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983988     Document Type: Conference Paper

References (10)

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