SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2344-2350

Formation of intermetallic compounds in the Ni bearing lead free composite solders

(3) Lee, Joo Won a Lee, Zin Hyoung a Lee, Hyuck Mo a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

Composite solder; Cu6Sn5; Intermetallics; Ni3Sn4; Nickel bearing solder; Solder interface

Indexed keywords

CHEMICAL BONDS; COMPOSITE MATERIALS; EUTECTICS; INTERMETALLICS; LEAD; NICKEL;

COMPOSITE SOLDER; CU6SN5; NI3SN4; NICKEL BEARING SOLDER; SOLDER INTERFACE;

SOLDERING;

EID: 30844433963 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.46.2344 Document Type: Article

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.