Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process

Applied Surface Science

Volumn 255, Issue 7, 2009, Pages 4205-4211

  Tian, Y B ^a,b   Zhou, L ^a   Shimizu, J ^a   Tashiro, Y ^c   Kang, R K ^b  

^a IBARAKI UNIVERSITY   (Japan)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^c Tokyo Diamond Tools Mfg Co   (Japan)

Author keywords

Chemo mechanical grinding; SAGW; Scratch; Silicon wafer; Surface roughness

Indexed keywords

GRINDING (MACHINING); GRINDING MACHINES; GRINDING WHEELS; INTEGRATED CIRCUITS; SINGLE CRYSTALS; SUBSTRATES; SURFACE ROUGHNESS; WHEELS;

CHEMO-MECHANICAL-GRINDING; ELIMINATION PROCESS; GRINDING CHARACTERISTICS; MATERIAL REMOVAL RATE; SAGW; SCRATCH; SUBSTRATE MATERIAL; SURFACE OF SINGLE CRYSTALS;

SILICON WAFERS;

EID: 58149093991     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.11.009     Document Type: Article

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