Defect-free fabrication for single crystal silicon substrate by chemo-mechanical grinding

CIRP Annals - Manufacturing Technology

Volumn 55, Issue 1, 2006, Pages 313-316

  Zhou, L ^a   Eda, H ^a   Shimizu, J ^a   Kamiya, S ^b   Iwase, H ^b   Kimura, S ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c Tokyo Diamond Tools Mfg Co   (Japan)

Author keywords

Grinding; Silicon; Wafer

Indexed keywords

ABRASIVES; CRYSTAL DEFECTS; ETCHING; GRINDING (MACHINING); SILICON; SILICON WAFERS;

GRINDING; MECHANICAL IMPERFECTION; SOLID-STATE REACTION;

SINGLE CRYSTALS;

EID: 33750053304     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60424-7     Document Type: Article

References (16)

1. Brinksmeier, E., Lucca, D.A. and Walter A., 2004, Chemical Aspects of Machining Process, Annals of CIRP, 53/2, 685-699.
2. Tönshoff, H.K., Schmieden, W.V., Inasaki, I., König, W. and Spur, G., 1990, Abrasive Machining of Silicon, Annals of CIRP, 39/2, 621-632.
3. Bifano, T.G., Dow, T.A and Scattergood,R.O., 1991, A New Technology for Machining Brittle Materials, ASME J. Eng'g for Industry, 113/2, 184-189.
4. Kallman, J.S., Hoover, W.G., Hoover, C.G., De Groot, A.J., Lee, S.M. and Wooten, F., 1993, Molecular Dynamics of Silicon Indentation, Physical Review B, 47/13, 7705-7709.
5. Zhang, L. and Zarudi, I., 2001, Towards a Deeper Understanding of Plastic Deformation in Single crystal Silicon, Int'l J. of Mechanical Sciences, 43, 1985-1996.
6. Tanaka, H., Shimada, S. and Ikawa, N., 2004, Brittle-Ductile Transition in Single crystal Silicon Analyzed by Molecular Dynamics Simulation, J. of Mechanical Engineering Science, 218, 583-590.
7. th Int'l Conf. on Wear of Materials, 25-29.
8. Namba, Y., Ohnishi, N., Yoshida, S., Harada, K. and Yoshida, K., 2004, Ultra-Precision Float Polishing of Calcium Fluoride Single Crystals for Deep Ultra Violet Applications, Annals of CIRP, 53/1, 459-462.
9. Taniguchi, N., 1996, Nanotechnology: Integrated Processing System for Ultra-precision and Ultra-fine Products, Oxford Science Publication, 18-63.
10. Shimada, S., Inamura, T., Higuchi, M., Tanaka, H. and Ikawa, N., 2000, Suppression of Tool Wear in Diamond Turning of Copper under Reduced Oxygen Atmosphere, Annals of CIRP, 49/1, 21-24.
11. 2 particles, J. Non-Crystalline Solids, 283, 129-136.
12. Zhou, L., Kawaii, S., Kimura, S., Shimizu, J. and EDA, H., 2003, Development of Chemo-Mechanical Grinding (CMC) Process, Proc. of Int'l Conf. on LEM21, 315-320
13. H. Eda, L. Zhou, H. Nakano, R. Kondo and J. Shimizu, 2001, Development of single step grinding system for large scale φ300 Si wafer, Annals of CIRP 50/1, 225-228.
14. 2 particle, J. of Applied Surface Science, 244, 34-38.
15. Peterson, K.E., 1982, Silicon as a Mechanical Material, Proc. IEEE, 70/5, 420-475.
16. Shorey, A.B., Kwong, K.M., Johnson, K.M. and Jacobs, S.D., 2000, Nanoindentation Hardness of Particles Used in Magnetorheological Finishing, Applied Optics, 39, 5194-5204.